TEAM is a full-service electronic contract manufacturer, with a high-mix, low to medium volume electronic facility. We can accommodate both consignment and turn-key jobs.

TEAM is an ISO 9001:2008 registered company and we strive to obtain the highest quality standards for industrial and government clients. TEAM has specific training for every employee ensuring that all personnel carry out their job functions and maintain the highest quality and procedural practices.

We have a fully automated surface mount production lines with a MyData MY12 and MyData MY9 pick place machines that places an average of 28,900 parts per hour. In addition, we have intelligent component feeders that can be pre loaded for faster line setup in order to eliminate component errors and mitigates risk.

At the front of our automated surface mount line is a printed circuit board stacker capable of feeding hundreds of panelized boards to our state-of-the-art automated solder paste applicator. The solder paste applicator can apply the programmed amount of solder paste to a panel in less then 15 seconds and send it to the MyData MY12 surface mount machine for rapid placement of parts.

At the core of our automated lines are state-of-the-art MyData MY12 and MY9, pick and place machines that together place an average of 28,900 parts per hour with an accuracy of 25 micro-meters and the capability of processing multiple jobs simultaneously. They can place chips as small as 01005 as well as SOIC, PLCC, TSPO, QFP, BGA, flip chip, surface mount connectors, CSP, and CCGA components.

Both machines have a verifier mode that checks the value of passive components as they are placed as well as diode orientation. In addition, these machines can simultaneously run more then one PCB through the insertion process at a time, which provides faster through put of jobs.

At the end of our automated is our reflow oven which consists of 7 stages regulated to ±1 degree centigrade enabling us to adjust our temperature profiles to precise ranges when reflowing BGA and SMT components. As a result, we fabricate PCBs that have lead and no-lead requirements (Restriction of Hazardous Substance (RoHS)). Each of these technologies requires very different temperature profiles in order to achieve first pass high yield results.

TEAM is accustomed to quick turn efforts and has processed various PCB’s in our facility. These efforts consist of BGA, mini BGA placement and X-ray, as well as SMT 0402 and 0201 component placement.

TEAM utilizes an automated conformal coating machine that is capable of coating numerous panels or multiple printed circuit boards at once. This machine can be programmed to the characteristics of the panel or boards and apply simultaneously coating to the top and bottom of the panel or boards. Typically the machine takes and average of 20 seconds to coat over 50 boards.